Publication:

CMP processing to enable 3D stacked IC integration

Date

2009
Proceedings Paper
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dc.contributor.authorVaes, Jan
dc.contributor.authorHeylen, Nancy
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorLeunissen, Peter
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.date.accessioned2021-10-18T03:50:47Z
dc.date.available2021-10-18T03:50:47Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16340
dc.source.conferenceInternational Conference on Planarization/CMP Technology - ICPT
dc.source.conferencedate19/11/2009
dc.source.conferencelocationFukuoka Japan
dc.title

CMP processing to enable 3D stacked IC integration

dc.typeProceedings paper
dspace.entity.typePublication
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