Publication:
Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison of for several IC-packages
Date
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Limaye, Paresh | |
| dc.contributor.author | Ratchev, Petar | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-15T17:26:34Z | |
| dc.date.available | 2021-10-15T17:26:34Z | |
| dc.date.issued | 2004-05 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/9830 | |
| dc.source.beginpage | 565 | |
| dc.source.conference | EuroSimE: 5th Int. Conf. on Thermal & Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems | |
| dc.source.conferencedate | 9/05/2004 | |
| dc.source.conferencelocation | Brussels Belgium | |
| dc.source.endpage | 570 | |
| dc.title | Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison of for several IC-packages | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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