Optimizing Direct Die-to-Wafer Hybrid Bonding: The Role of Scanner Precorrection in Achieving fine Overlay Performance

Abstract

In this work, we characterize the in-plane and out-of-plane deformation of the dies following the imec die-to-wafer (D2W) bonding flow. By leveraging this result of alignment readout and leveling metrologies on scanner, we could improve the post-D2W bonding overlay performance through scanner precorrection for advanced packaging and heterogeneous integration system.