Publication:

Optimizing Direct Die-to-Wafer Hybrid Bonding: The Role of Scanner Precorrection in Achieving fine Overlay Performance

Date

2025
Proceedings Paper
https://doi.org/10.1109/IITC66087.2025.11075428
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dc.contributor.authorHsu, Alex
dc.contributor.authorJadli, Imene
dc.contributor.authorSuhard, Samuel
dc.contributor.authorJourdain, Anne
dc.contributor.authorMiller, Andy
dc.contributor.authorTamaddon, Amir-Hossein
dc.contributor.authorKennes, Koen
dc.contributor.authorDe Poortere, Etienne
dc.contributor.authorBlanco, Victor
dc.date.accessioned2026-04-27T08:47:25Z
dc.date.available2026-04-27T08:47:25Z
dc.date.createdwos2025-10-18
dc.date.issued2025
dc.description.abstractIn this work, we characterize the in-plane and out-of-plane deformation of the dies following the imec die-to-wafer (D2W) bonding flow. By leveraging this result of alignment readout and leveling metrologies on scanner, we could improve the post-D2W bonding overlay performance through scanner precorrection for advanced packaging and heterogeneous integration system.
dc.identifier.doi10.1109/IITC66087.2025.11075428
dc.identifier.isbn979-8-3315-3782-1
dc.identifier.issn2380-632X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59196
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC)
dc.source.conferencedate2025-06-02
dc.source.conferencelocationBusan
dc.source.journal2025 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC
dc.source.numberofpages3
dc.title

Optimizing Direct Die-to-Wafer Hybrid Bonding: The Role of Scanner Precorrection in Achieving fine Overlay Performance

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2025-10-22
imec.internal.sourcecrawler
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