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Chemical mechanical planarization of patterned InP in shallow trench isolation (STI) template structures using hydrogen peroxide-based silica slurries containing oxalic acid or citric acid
Publication:
Chemical mechanical planarization of patterned InP in shallow trench isolation (STI) template structures using hydrogen peroxide-based silica slurries containing oxalic acid or citric acid
Date
2014
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Matovu, John B.
;
Ong, Patrick
;
Teugels, Lieve
;
Leunissen, Peter
;
Babu, S. V.
Journal
Microelectronic Engineering
Abstract
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1890
since deposited on 2021-10-22
Acq. date: 2025-10-23
Citations
Metrics
Views
1890
since deposited on 2021-10-22
Acq. date: 2025-10-23
Citations