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Binary and ternary intermetallics for advanced interconnect metallization
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Binary and ternary intermetallics for advanced interconnect metallization
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Date
2024-04
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Soulie, Jean-Philippe
;
Heylen, Nancy
;
Sankaran, Kiroubanand
;
Scheerder, Jeroen
;
Fleischmann, Claudia
;
Swerts, Johan
;
Tokei, Zsolt
;
Adelmann, Christoph
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532
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Acq. date: 2026-01-27
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Statistics
Views
532
since deposited on 2024-05-28
13
last month
Acq. date: 2026-01-27
Citations