Publication:

New bending mode in SAQP Si fins and its mitigation

Date

2022

Journal article

https://doi.org/10.1016/j.mssp.2021.106437

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Author(s)

Sepulveda Marquez, Alfonso

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Baudot, Sylvain

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Briggs, Basoene

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Altamirano Sanchez, Efrain

Journal

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

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1450 since deposited on 2023-06-20

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Acq. date: 2026-06-06