Publication:
New bending mode in SAQP Si fins and its mitigation
| dc.contributor.author | Sepulveda Marquez, Alfonso | |
| dc.contributor.author | Hellin, David | |
| dc.contributor.author | Zhang, Liping | |
| dc.contributor.author | Kenis, Karine | |
| dc.contributor.author | Batuk, Dmitry | |
| dc.contributor.author | Baudot, Sylvain | |
| dc.contributor.author | Briggs, Basoene | |
| dc.contributor.author | Mountsier, Tom | |
| dc.contributor.author | Barla, Kathy | |
| dc.contributor.author | Morin, Pierre | |
| dc.contributor.author | Altamirano Sanchez, Efrain | |
| dc.contributor.imecauthor | Sepulveda Marquez, Alfonso | |
| dc.contributor.imecauthor | Zhang, Liping | |
| dc.contributor.imecauthor | Kenis, Karine | |
| dc.contributor.imecauthor | Batuk, Dmitry | |
| dc.contributor.imecauthor | Baudot, Sylvain | |
| dc.contributor.imecauthor | Briggs, Basoene | |
| dc.contributor.imecauthor | Barla, Kathy | |
| dc.contributor.imecauthor | Morin, Pierre | |
| dc.contributor.imecauthor | Altamirano Sanchez, Efrain | |
| dc.contributor.orcidimec | Zhang, Liping::0000-0002-2947-8660 | |
| dc.contributor.orcidimec | Sanchez, Efrain Altamirano::0000-0003-3235-6055 | |
| dc.contributor.orcidimec | Batuk, Dmitry::0000-0002-6384-6690 | |
| dc.contributor.orcidimec | Morin, Pierre::0000-0002-4637-496X | |
| dc.contributor.orcidimec | Sepulveda Marquez, Alfonso::0000-0003-4726-177X | |
| dc.contributor.orcidimec | Altamirano Sanchez, Efrain::0000-0003-3235-6055 | |
| dc.contributor.orcidimec | Kenis, Karine::0000-0001-7116-7498 | |
| dc.date.accessioned | 2023-06-20T13:57:09Z | |
| dc.date.available | 2023-06-20T10:34:30Z | |
| dc.date.available | 2023-06-20T13:57:09Z | |
| dc.date.issued | 2022 | |
| dc.description.wosFundingText | The authors would like to acknowledge the Logic Program of imec, the Materials and Components Analysis team (MCA) , the SEM/TEMteam and Arenberg 300 mm pilot line for their support. P.M. is deeply grateful to Dr. Shay Reboh from CEA Leti for former collaboration and discussion on mechanical modelling, applied here to establish equation (5) . | |
| dc.identifier.doi | 10.1016/j.mssp.2021.106437 | |
| dc.identifier.issn | 1369-8001 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/41852 | |
| dc.publisher | ELSEVIER SCI LTD | |
| dc.source.beginpage | Art. 106437 | |
| dc.source.endpage | na | |
| dc.source.issue | April | |
| dc.source.journal | MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING | |
| dc.source.numberofpages | 8 | |
| dc.source.volume | 141 | |
| dc.title | New bending mode in SAQP Si fins and its mitigation | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
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