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Advanced wire bonding: bonding on copper
Publication:
Advanced wire bonding: bonding on copper
Date
2002
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ho, Meng
;
Lam, Kan Wai
;
Stoukatch, Serguei
;
Ratchev, Petar
;
Vath, C. J.
;
Beyne, Eric
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1967
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Views
1967
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations