Publication:

Advanced wire bonding: bonding on copper

Date

2002
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorHo, Meng
dc.contributor.authorLam, Kan Wai
dc.contributor.authorStoukatch, Serguei
dc.contributor.authorRatchev, Petar
dc.contributor.authorVath, C. J.
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-14T21:48:16Z
dc.date.available2021-10-14T21:48:16Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6396
dc.source.beginpage27
dc.source.conferenceProceedings of the European Microelectronics Packaging and Interconnection Symposium - IMAPS-EUROPE
dc.source.conferencedate16/06/2002
dc.source.conferencelocationCracow Poland
dc.source.endpage32
dc.title

Advanced wire bonding: bonding on copper

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions