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Compact thermally stable high voltage FinFET with 40 nm tox and lateral break-down >35 V for 3D NAND flash periphery application

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96 since deposited on 2024-02-20
Acq. date: 2026-02-24

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96 since deposited on 2024-02-20
Acq. date: 2026-02-24

Citations