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Compact thermally stable high voltage FinFET with 40 nm tox and lateral break-down >35 V for 3D NAND flash periphery application

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103 since deposited on 2024-02-20
3last month
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Acq. date: 2026-05-17

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103 since deposited on 2024-02-20
3last month
1last week
Acq. date: 2026-05-17

Citations