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Conference contributions
Low damage ULK etching by means of high boiling point organic condensation
Publication:
Low damage ULK etching by means of high boiling point organic condensation
Date
2017
Meeting abstract
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Chanson, Romain
;
Holtzer, Nicolas
;
Lefaucheux, Philippe
;
Dussart, Rémi
;
SHEN, Peng
;
URABE, Keiichiro
;
Dussarat, Christian
;
Maekawa, Kaoru
;
yatsuda, koichi
;
Tahara, Shigeru
;
de Marneffe, Jean-Francois
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1959
since deposited on 2021-10-24
Acq. date: 2025-10-23
Citations
Metrics
Views
1959
since deposited on 2021-10-24
Acq. date: 2025-10-23
Citations