Publication:

Low damage ULK etching by means of high boiling point organic condensation

Date

2017
Meeting abstract
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dc.contributor.authorChanson, Romain
dc.contributor.authorHoltzer, Nicolas
dc.contributor.authorLefaucheux, Philippe
dc.contributor.authorDussart, Rémi
dc.contributor.authorSHEN, Peng
dc.contributor.authorURABE, Keiichiro
dc.contributor.authorDussarat, Christian
dc.contributor.authorMaekawa, Kaoru
dc.contributor.authoryatsuda, koichi
dc.contributor.authorTahara, Shigeru
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.date.accessioned2021-10-24T03:23:00Z
dc.date.available2021-10-24T03:23:00Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28001
dc.identifier.urlhttps://mrsspring.zerista.com/event/member/365505
dc.source.beginpageED9.3.03
dc.source.conferenceMaterials Research Society Spring Meeting
dc.source.conferencedate17/04/2017
dc.source.conferencelocationPhoenix, AZ USA
dc.title

Low damage ULK etching by means of high boiling point organic condensation

dc.typeMeeting abstract
dspace.entity.typePublication
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