Publication:

Investigating the Efficacy of Hafnium Dioxide Barrier Layers to Halt Copper Oxide Formation in Redistribution Layers for Three-Dimensional (3D) Packaging

Date

2022
Journal article
https://doi.org/10.1021/acs.jpclett.2c02080
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dc.contributor.authorBrady-Boyd, Anita
dc.contributor.authorChery, Emmanuel
dc.contributor.authorArmini, Silvia
dc.contributor.imecauthorBrady-Boyd, Anita
dc.contributor.imecauthorChery, Emmanuel
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecBrady-Boyd, Anita::0000-0002-9257-6837
dc.contributor.orcidimecChery, Emmanuel::0000-0002-2526-3873
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.date.accessioned2022-11-10T09:28:36Z
dc.date.available2022-09-08T02:38:35Z
dc.date.available2022-11-10T09:28:36Z
dc.date.issued2022
dc.description.wosFundingTextThis project has received funding from the European Union's Horizon 2020 research and innovation programme under the Marie Sklodowska-Curie g r a n t agreement No. 888163. The authors would like to thank Dr. E. Vancoille and Dr. O. Richard for the FIB analysis. Our sincere thanks and appreciation go to JSR Corporation and JSR Micro N.V. for providing the photosensitive polymer used in this study.
dc.identifier.doi10.1021/acs.jpclett.2c02080
dc.identifier.issn1948-7185
dc.identifier.pmidMEDLINE:36000826
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40364
dc.publisherAMER CHEMICAL SOC
dc.source.beginpage8130
dc.source.endpage8133
dc.source.issue34
dc.source.journalJOURNAL OF PHYSICAL CHEMISTRY LETTERS
dc.source.numberofpages4
dc.source.volume13
dc.subject.keywordsTHROUGH-SILICON
dc.subject.keywordsRELIABILITY
dc.title

Investigating the Efficacy of Hafnium Dioxide Barrier Layers to Halt Copper Oxide Formation in Redistribution Layers for Three-Dimensional (3D) Packaging

dc.typeJournal article
dspace.entity.typePublication
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