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Cleaning of post-etch photoresist layer on patterned surface using organic solvent combined with physical forces

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dc.contributor.authorLe, Quoc Toan
dc.contributor.authorChiodarelli, Nicolo
dc.contributor.authorBlum, Ivan
dc.contributor.authorKesters, Els
dc.contributor.authorLux, Marcel
dc.contributor.authorClaes, Martine
dc.contributor.authorVereecke, Guy
dc.contributor.authorMertens, Paul
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.accessioned2021-10-16T17:21:15Z
dc.date.available2021-10-16T17:21:15Z
dc.date.issued2007-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12453
dc.source.conferenceSurface Preparation and Cleaning Conference
dc.source.conferencedate25/04/2007
dc.source.conferencelocationAustin, TX USA
dc.title

Cleaning of post-etch photoresist layer on patterned surface using organic solvent combined with physical forces

dc.typeProceedings paper
dspace.entity.typePublication
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