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Pattern roughness mitigation of 22 nm lines and spaces: The impact of H2 plasma treatment

Date

2015
Journal article
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dc.contributor.authorDe Schepper, Peter
dc.contributor.authorVaglio Pret, Alessandro
dc.contributor.authorEl Otell, Ziad
dc.contributor.authorHansen, Terje
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.authorDe Gendt, Stefan
dc.contributor.imecauthorDe Schepper, Peter
dc.contributor.imecauthorVaglio Pret, Alessandro
dc.contributor.imecauthorEl Otell, Ziad
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.accessioned2021-10-22T18:52:23Z
dc.date.available2021-10-22T18:52:23Z
dc.date.embargo9999-12-31
dc.date.issued2015
dc.identifier.issn1612-8850
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25152
dc.identifier.urlhttp://onlinelibrary.wiley.com/doi/10.1002/ppap.201400078/abstract
dc.source.beginpage153
dc.source.endpage161
dc.source.issue2
dc.source.journalPlasma Processes and Polymers
dc.source.volume12
dc.title

Pattern roughness mitigation of 22 nm lines and spaces: The impact of H2 plasma treatment

dc.typeJournal article
dspace.entity.typePublication
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