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Interface evolution of epoxy layers due to wet-chemical treatments and its relevance to adhesion of electrochemically deposited copper
Publication:
Interface evolution of epoxy layers due to wet-chemical treatments and its relevance to adhesion of electrochemically deposited copper
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Date
2005-05
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Siau, S.
;
Vervaet, A.
;
Schacht, E.
;
Van Calster, Andre
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Acq. date: 2025-12-11
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Views
1920
since deposited on 2021-10-16
1
last month
1
last week
Acq. date: 2025-12-11
Citations