Publication:
Interface evolution of epoxy layers due to wet-chemical treatments and its relevance to adhesion of electrochemically deposited copper
Date
| dc.contributor.author | Siau, S. | |
| dc.contributor.author | Vervaet, A. | |
| dc.contributor.author | Schacht, E. | |
| dc.contributor.author | Van Calster, Andre | |
| dc.contributor.imecauthor | Van Calster, Andre | |
| dc.date.accessioned | 2021-10-16T05:01:35Z | |
| dc.date.available | 2021-10-16T05:01:35Z | |
| dc.date.issued | 2005-05 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/11198 | |
| dc.source.beginpage | 348 | |
| dc.source.conference | Meeting Abstracts of the 207th meeting of The Electrochemical Society | |
| dc.source.conferencedate | 15/05/2005 | |
| dc.source.conferencelocation | Quebec Canada | |
| dc.title | Interface evolution of epoxy layers due to wet-chemical treatments and its relevance to adhesion of electrochemically deposited copper | |
| dc.type | Meeting abstract | |
| dspace.entity.type | Publication | |
| Files | ||
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