Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
Scaled TaN barriers for Cu interconnects: reliability performance
Publication:
Scaled TaN barriers for Cu interconnects: reliability performance
Copy permalink
Date
2019
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Varela Pedreira, Olalla
;
Lesniewska, Alicja
;
Jourdan, Nicolas
;
Vega Gonzalez, Victor
;
Lariviere, Stephane
;
van der Veen, Marleen
;
Croes, Kristof
;
Tokei, Zsolt
Journal
Abstract
Description
Metrics
Views
1975
since deposited on 2021-10-27
6
last month
5
last week
Acq. date: 2025-12-15
Citations
Metrics
Views
1975
since deposited on 2021-10-27
6
last month
5
last week
Acq. date: 2025-12-15
Citations