Publication:

Scaled TaN barriers for Cu interconnects: reliability performance

Date

2019
Proceedings Paper
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dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorLariviere, Stephane
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorCroes, Kristof
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorLariviere, Stephane
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-27T22:03:37Z
dc.date.available2021-10-27T22:03:37Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34328
dc.identifier.urlhttps://iitc-conference.org/technical-program-abstracts.html
dc.source.beginpage12.2
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019)
dc.source.conferencedate3/06/2019
dc.source.conferencelocationBrussels belgium
dc.title

Scaled TaN barriers for Cu interconnects: reliability performance

dc.typeProceedings paper
dspace.entity.typePublication
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