Publication:

Cu1-xAlx films as alternatives to copper for advanced interconnect metallization

Date

2024
Journal article
https://doi.org/10.1116/6.0003634
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Author(s)

Soulie, Jean-Philippe  
;
Sankaran, Kiroubanand  
;
Pourtois, Geoffrey  
;
Swerts, Johan  
;
Tokei, Zsolt  
;
Adelmann, Christoph  

Journal

Journal of vacuum science and technology B

Abstract

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503 since deposited on 2024-06-21
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503 since deposited on 2024-06-21
12last month
3last week
Acq. date: 2026-01-27

Citations