Publication:

Cu1-xAlx films as alternatives to copper for advanced interconnect metallization

Date

2024
Journal article
https://doi.org/10.1116/6.0003634
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dc.contributor.authorSoulie, Jean-Philippe
dc.contributor.authorSankaran, Kiroubanand
dc.contributor.authorPourtois, Geoffrey
dc.contributor.authorSwerts, Johan
dc.contributor.authorTokei, Zsolt
dc.contributor.authorAdelmann, Christoph
dc.contributor.imecauthorSoulie, Jean-Philippe
dc.contributor.imecauthorSankaran, Kiroubanand
dc.contributor.imecauthorPourtois, Geoffrey
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.orcidimecSoulie, Jean-Philippe::0000-0002-5956-6485
dc.contributor.orcidimecSankaran, Kiroubanand::0000-0001-6988-7269
dc.contributor.orcidimecPourtois, Geoffrey::0000-0003-2597-8534
dc.contributor.orcidimecSwerts, Johan::0000-0001-7547-7194
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.date.accessioned2024-06-21T11:27:47Z
dc.date.available2024-06-21T11:27:47Z
dc.date.issued2024
dc.identifier.doi10.1116/6.0003634
dc.identifier.issn1071-1023
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44069
dc.source.beginpage043203-1
dc.source.endpage043203-8
dc.source.issue4
dc.source.journalJournal of vacuum science and technology B
dc.source.numberofpages8
dc.source.volume42
dc.title

Cu1-xAlx films as alternatives to copper for advanced interconnect metallization

dc.typeJournal article
dspace.entity.typePublication
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