Publication:

Investigating moisture diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)

Date

2022

Proceedings Paper

https://doi.org/10.1109/ECTC51906.2022.00268

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Author(s)

Salahouelhadj, Abdellah

;

Gonzalez, Mario

;

;

Journal

na

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1404 since deposited on 2022-09-17

Acq. date: 2026-02-24