Investigating moisture diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)

dc.contributor.author	Salahouelhadj, Abdellah
dc.contributor.author	Gonzalez, Mario
dc.contributor.author	Podpod, Arnita
dc.contributor.author	Beyne, Eric
dc.contributor.imecauthor	Salahouelhadj, Abdellah
dc.contributor.imecauthor	Gonzalez, Mario
dc.contributor.imecauthor	Podpod, Arnita
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.orcidimec	Salahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimec	Gonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.date.accessioned	2023-02-20T13:59:11Z
dc.date.available	2022-09-17T02:52:08Z
dc.date.available	2023-02-20T13:59:11Z
dc.date.issued	2022
dc.identifier.doi	10.1109/ECTC51906.2022.00268
dc.identifier.eisbn	978-1-6654-7943-1
dc.identifier.issn	0569-5503
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/40442
dc.publisher	IEEE
dc.source.beginpage	1704
dc.source.conference	72nd IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedate	MAY 31-JUN 01, 2022
dc.source.conferencelocation	San Diego
dc.source.endpage	1710
dc.source.journal	na
dc.source.numberofpages	7
dc.subject.keywords	MASS DIFFUSION
dc.subject.keywords	EPOXY
dc.subject.keywords	ABSORPTION
dc.subject.keywords	SORPTION
dc.subject.keywords	MODEL
dc.title	Investigating moisture diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)
dc.type	Proceedings paper
dspace.entity.type	Publication
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