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Electrical and microstructural characterization of narrow Cu interconnects
Publication:
Electrical and microstructural characterization of narrow Cu interconnects
Date
2004
Proceedings Paper
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9076.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wu, Wen
;
Brongersma, Sywert
;
Vervoort, Iwan
;
Bender, Hugo
;
Van Hove, Marleen
;
Maex, Karen
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1934
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations
Metrics
Views
1934
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations