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Conference contributions
Electrical and microstructural characterization of narrow Cu interconnects
Publication:
Electrical and microstructural characterization of narrow Cu interconnects
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Date
2004
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wu, Wen
;
Brongersma, Sywert
;
Vervoort, Iwan
;
Bender, Hugo
;
Van Hove, Marleen
;
Maex, Karen
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1938
since deposited on 2021-10-15
1
last month
Acq. date: 2026-01-11
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Metrics
Views
1938
since deposited on 2021-10-15
1
last month
Acq. date: 2026-01-11
Citations