Publication:

Electrical and microstructural characterization of narrow Cu interconnects

Date

2004
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorWu, Wen
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorVervoort, Iwan
dc.contributor.authorBender, Hugo
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.date.accessioned2021-10-15T18:01:50Z
dc.date.available2021-10-15T18:01:50Z
dc.date.embargo9999-12-31
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9938
dc.source.beginpage225
dc.source.conferenceAdvanced Metallization Conference 2003
dc.source.conferencedate21/10/2003
dc.source.conferencelocationMontreal/Tokyo
dc.source.endpage229
dc.title

Electrical and microstructural characterization of narrow Cu interconnects

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
9076.pdf
Size:
425.71 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions