Publication:

Directional Etching of Barrierless NiAl Lines on 300-mm Wafers for Interconnects Applications

Date

2024
Journal article
https://doi.org/10.1109/LED.2024.3449219
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dc.contributor.authorKundu, Souvik
dc.contributor.authorSoulie, Jean-Philippe
dc.contributor.authorMarti, Giulio
dc.contributor.authorUlu Okudur, Fulya
dc.contributor.authorKundu, Shreya
dc.contributor.authorSouriau, Laurent
dc.contributor.authorLazzarino, Frederic
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorPark, Seongho
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorKundu, Souvik
dc.contributor.imecauthorKundu, Shreya
dc.contributor.imecauthorSoulie, Jean-Philippe
dc.contributor.imecauthorMarti, Giulio
dc.contributor.imecauthorUlu Okudur, Fulya
dc.contributor.imecauthorSouriau, Laurent
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorPark, Seongho
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecKundu, Souvik::0000-0001-5815-8765
dc.contributor.orcidimecKundu, Shreya::0000-0001-8052-7774
dc.contributor.orcidimecSoulie, Jean-Philippe::0000-0002-5956-6485
dc.contributor.orcidimecUlu Okudur, Fulya::0000-0002-8046-7748
dc.contributor.orcidimecSouriau, Laurent::0000-0002-5138-5938
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecMurdoch, Gayle::0000-0002-6833-220X
dc.contributor.orcidimecPark, Seongho::0000-0002-1058-9424
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.date.accessioned2025-07-31T07:03:07Z
dc.date.available2024-11-30T16:46:41Z
dc.date.available2025-07-31T07:03:07Z
dc.date.issued2024
dc.identifier.doi10.1109/LED.2024.3449219
dc.identifier.issn0741-3106
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44876
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage2033
dc.source.endpage2035
dc.source.issue10
dc.source.journalIEEE ELECTRON DEVICE LETTERS
dc.source.numberofpages3
dc.source.volume45
dc.title

Directional Etching of Barrierless NiAl Lines on 300-mm Wafers for Interconnects Applications

dc.typeJournal article
dspace.entity.typePublication
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