Publication:

Investigation of advanced dicing technologies for ultra low-k and 3D integration

Date

2016
Proceedings Paper
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dc.contributor.authorPodpod, Arnita
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorGonzalez, Mario
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T13:46:21Z
dc.date.available2021-10-23T13:46:21Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27152
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7545585/?arnumber=7545585
dc.source.beginpage1247
dc.source.conferenceIEEE 66th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2016
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage1258
dc.title

Investigation of advanced dicing technologies for ultra low-k and 3D integration

dc.typeProceedings paper
dspace.entity.typePublication
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