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28nm pitch of line/space pattern transfer into silicon substrates with chemo-epitaxy directed self-assembly (DSA) process flow

Date

2013
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dc.contributor.authorChan, BT
dc.contributor.authorTahara, Shigeru
dc.contributor.authorParnell, Doni
dc.contributor.authorRincon Delgadillo, Paulina
dc.contributor.authorGronheid, Roel
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorXu, Kaidong
dc.contributor.authorNishimura, Eiichi
dc.contributor.authorWerner, Thilo
dc.contributor.imecauthorChan, BT
dc.contributor.imecauthorRincon Delgadillo, Paulina
dc.contributor.imecauthorGronheid, Roel
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.orcidimecChan, BT::0000-0003-2890-0388
dc.date.accessioned2021-10-21T06:55:07Z
dc.date.available2021-10-21T06:55:07Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22121
dc.source.conference39th International Conference on Micro and Nano Engineering - MNE
dc.source.conferencedate17/09/2013
dc.source.conferencelocationLondon UK
dc.title

28nm pitch of line/space pattern transfer into silicon substrates with chemo-epitaxy directed self-assembly (DSA) process flow

dc.typeOral presentation
dspace.entity.typePublication
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