Publication:

Low temperature through-Si via fabrication using electroless deposition

Date

2012
Proceedings Paper
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dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorRadisic, Alex
dc.contributor.authorArmini, Silvia
dc.contributor.authorLeunissen, Peter
dc.contributor.authorMiyake, Hiroshi
dc.contributor.authorArima, Ryohei
dc.contributor.authorShimizu, Tomohiro
dc.contributor.authorIto, Toshiaki
dc.contributor.authorSeki, Hirofumi
dc.contributor.authorShinozaki, Yuko
dc.contributor.authorYamamoto, Tomohiko
dc.contributor.authorShingubara, Shoso
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.date.accessioned2021-10-20T11:47:12Z
dc.date.available2021-10-20T11:47:12Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20845
dc.identifier.urlhttp://dx.doi.org/10.1109/3DIC.2012.6262984
dc.source.beginpage1
dc.source.conferenceIEEE International 3D System Integration Conference - 3DIC
dc.source.conferencedate31/01/2012
dc.source.conferencelocationOsaka Japan
dc.source.endpage4
dc.title

Low temperature through-Si via fabrication using electroless deposition

dc.typeProceedings paper
dspace.entity.typePublication
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