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Articles
Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology
Publication:
Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology
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Date
2010
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21078.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Govaerts, Jonathan
;
Bosman, Erwin
;
Christiaens, Wim
;
Vanfleteren, Jan
Journal
IEEE Transactions on Advanced Packaging
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1968
since deposited on 2021-10-18
Acq. date: 2025-12-11
Citations
Metrics
Views
1968
since deposited on 2021-10-18
Acq. date: 2025-12-11
Citations