Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
Simulations of Wafer-to-Wafer Bonding Dynamics and Deformation Mechanisms
Publication:
Simulations of Wafer-to-Wafer Bonding Dynamics and Deformation Mechanisms
Copy permalink
Date
2024
Proceedings Paper
https://doi.org/10.1109/ESTC60143.2024.10712136
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Okudur, Oguzhan Orkut
;
Iacovo, Serena
;
Kang, Shuo
;
Gonzalez, Mario
;
Beyne, Eric
Journal
N/A
Abstract
Description
Metrics
Views
274
since deposited on 2025-02-15
3
last month
1
last week
Acq. date: 2025-12-15
Citations
Metrics
Views
274
since deposited on 2025-02-15
3
last month
1
last week
Acq. date: 2025-12-15
Citations