Simulations of Wafer-to-Wafer Bonding Dynamics and Deformation Mechanisms

dc.contributor.author	Okudur, Oguzhan Orkut
dc.contributor.author	Iacovo, Serena
dc.contributor.author	Kang, Shuo
dc.contributor.author	Gonzalez, Mario
dc.contributor.author	Beyne, Eric
dc.contributor.imecauthor	Okudur, Oguzhan Orkut
dc.contributor.imecauthor	Iacovo, Serena
dc.contributor.imecauthor	Kang, Shuo
dc.contributor.imecauthor	Gonzalez, Mario
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.orcidimec	Okudur, Oguzhan Orkut::0000-0002-4790-7772
dc.contributor.orcidimec	Iacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimec	Gonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.date.accessioned	2025-04-16T08:50:10Z
dc.date.available	2025-02-15T21:13:54Z
dc.date.available	2025-04-16T08:50:10Z
dc.date.issued	2024
dc.identifier.doi	10.1109/ESTC60143.2024.10712136
dc.identifier.eisbn	979-8-3503-9036-0
dc.identifier.isbn	979-8-3503-9037-7
dc.identifier.issn	2687-9700
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/45205
dc.publisher	IEEE
dc.source.conference	10th IEEE Electronics System-Integration Technology Conference (ESTC)
dc.source.conferencedate	SEP 11-13, 2024
dc.source.conferencelocation	Berlin
dc.source.journal	N/A
dc.source.numberofpages	5
dc.title	Simulations of Wafer-to-Wafer Bonding Dynamics and Deformation Mechanisms
dc.type	Proceedings paper
dspace.entity.type	Publication
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