Publication:
In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures
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1863 since deposited on 2021-10-21
1last month
Acq. date: 2025-12-14
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Views
1863 since deposited on 2021-10-21
1last month
Acq. date: 2025-12-14
Citations