Publication:

In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures

Date

2013
Meeting abstract
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dc.contributor.authorVanstreels, Kris
dc.contributor.authorCzarnecki, Piotr
dc.contributor.authorKirimura, Tomoyuki
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorCroes, Kristof
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorCzarnecki, Piotr
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecCzarnecki, Piotr::0000-0002-3648-3046
dc.contributor.orcidimecBoemmels, Juergen::0000-0002-8761-5213
dc.date.accessioned2021-10-21T13:51:08Z
dc.date.available2021-10-21T13:51:08Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23306
dc.source.beginpage201
dc.source.conferenceMaterials for Advanced Metallization - MAM
dc.source.conferencedate10/03/2013
dc.source.conferencelocationLeuven Belgium
dc.source.endpage202
dc.title

In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures

dc.typeMeeting abstract
dspace.entity.typePublication
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