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Conference contributions
Integration of electroless and electrolytic Cu in the IC back end line of technologies
Publication:
Integration of electroless and electrolytic Cu in the IC back end line of technologies
Date
1999
Meeting abstract
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3613.pdf
345.26 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Maex, Karen
;
Palmans, Roger
;
Lantasov, Yuri
;
Brongersma, Sywert
;
Richard, Emmanuel
;
Vervoort, Iwan
Journal
Abstract
Description
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Views
1950
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Views
1950
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations