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Integration of electroless and electrolytic Cu in the IC back end line of technologies

Date

1999
Meeting abstract
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dc.contributor.authorMaex, Karen
dc.contributor.authorPalmans, Roger
dc.contributor.authorLantasov, Yuri
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorRichard, Emmanuel
dc.contributor.authorVervoort, Iwan
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.date.accessioned2021-10-14T11:29:56Z
dc.date.available2021-10-14T11:29:56Z
dc.date.embargo9999-12-31
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3646
dc.source.beginpage903
dc.source.conference196th Meeting of the Electrochemical Society: 3rd Int. Symposium on Electrochemical Technology Applications in Electronics
dc.source.conferencedate17/10/1999
dc.source.conferencelocationHonolulu, HI USA
dc.title

Integration of electroless and electrolytic Cu in the IC back end line of technologies

dc.typeMeeting abstract
dspace.entity.typePublication
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