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Transfer of a high temperature LPCVD-SiN photonic layer on wafers with thermal budget limitations
Publication:
Transfer of a high temperature LPCVD-SiN photonic layer on wafers with thermal budget limitations
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Date
2024
Proceedings Paper
https://doi.org/10.1109/OMN61224.2024.10685248
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Pham, Nga
;
O'Callaghan, John
;
Thanjavur Prakasam, Vittal
;
Neutens, Pieter
;
Ceuppens, Joris
;
Visker, Jakob
;
Zhou, Di
;
Helin, Philippe
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N/A
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126
since deposited on 2024-12-04
Acq. date: 2025-12-17
Citations
Metrics
Views
126
since deposited on 2024-12-04
Acq. date: 2025-12-17
Citations