Publication:
Kupfer-zu-Kupfer Wire-Bonding erfordert eine Anpassung des Bondprozesses - Massnahmen gegen die Oxidationsgefahr
Date
| dc.contributor.author | Van Bavel, Mieke | |
| dc.contributor.author | Degryse, Dominiek | |
| dc.contributor.author | Stoukatch, Serguei | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Van Bavel, Mieke | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-15T16:47:36Z | |
| dc.date.available | 2021-10-15T16:47:36Z | |
| dc.date.issued | 2004-04 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/9705 | |
| dc.source.beginpage | 50 | |
| dc.source.endpage | 52 | |
| dc.source.journal | Elektronik Produktion & Prüftechnik | |
| dc.title | Kupfer-zu-Kupfer Wire-Bonding erfordert eine Anpassung des Bondprozesses - Massnahmen gegen die Oxidationsgefahr | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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