Publication:

Copper oxide direct bonding of 200mm CMOS wafers: morphological and electrical characterization

Date

2015
Proceedings Paper
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dc.contributor.authorCavaco, Celso
dc.contributor.authorPeng, Lan
dc.contributor.authorDe Leersnijder, Koen
dc.contributor.authorGuerrieri, Stefano
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorOsman, Haris
dc.contributor.imecauthorCavaco, Celso
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorDe Leersnijder, Koen
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorOsman, Haris
dc.contributor.orcidimecCavaco, Celso::0000-0001-9079-338X
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.date.accessioned2021-10-22T18:37:08Z
dc.date.available2021-10-22T18:37:08Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25036
dc.source.beginpage594
dc.source.conferenceIMAPS 48th Annual international symposium on Microelectronics
dc.source.conferencedate26/10/2015
dc.source.conferencelocationOrlando, FL United States
dc.source.endpage597
dc.title

Copper oxide direct bonding of 200mm CMOS wafers: morphological and electrical characterization

dc.typeProceedings paper
dspace.entity.typePublication
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