Publication:

Edge trimming for surface activated dielectric bonded wafers

Date

2017
Journal article
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dc.contributor.authorInoue, Fumihiro
dc.contributor.authorJourdain, Anne
dc.contributor.authorVisker, Jakob
dc.contributor.authorPeng, Lan
dc.contributor.authorMoeller, Berthold
dc.contributor.authorYokoyama, Yokoyama
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorSleeckx, Erik
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVisker, Jakob
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.date.accessioned2021-10-24T06:07:06Z
dc.date.available2021-10-24T06:07:06Z
dc.date.issued2017
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28565
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0167931716304488
dc.source.beginpage10
dc.source.endpage16
dc.source.journalMicroelectronic Engineering
dc.source.volume167
dc.title

Edge trimming for surface activated dielectric bonded wafers

dc.typeJournal article
dspace.entity.typePublication
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