Publication:
Surface planarization of Cu and CuNiSn micro-bumps embedded in polymer for below 20μm pitch 3DIC applications
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1911 since deposited on 2021-10-22
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Acq. date: 2026-04-05
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Statistics
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1911 since deposited on 2021-10-22
1last month
1last week
Acq. date: 2026-04-05
Citations