Publication:
Surface planarization of Cu and CuNiSn micro-bumps embedded in polymer for below 20μm pitch 3DIC applications
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1916 since deposited on 2021-10-22
4last month
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Acq. date: 2026-08-09
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Statistics
Views
1916 since deposited on 2021-10-22
4last month
2last week
Acq. date: 2026-08-09
Citations