Publication:

Surface planarization of Cu and CuNiSn micro-bumps embedded in polymer for below 20μm pitch 3DIC applications

Date

2015
Meeting abstract
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dc.contributor.authorDe Preter, Inge
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorHeylen, Nancy
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.date.accessioned2021-10-22T18:51:28Z
dc.date.available2021-10-22T18:51:28Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25146
dc.source.conference32nd Advanced Metallization Conference - AMC
dc.source.conferencedate18/05/2015
dc.source.conferencelocationAustin, TX USA
dc.title

Surface planarization of Cu and CuNiSn micro-bumps embedded in polymer for below 20μm pitch 3DIC applications

dc.typeMeeting abstract
dspace.entity.typePublication
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