Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
FEM study of deformation and stresses in copper wire bonds on Cu lowK structures during processing
Publication:
FEM study of deformation and stresses in copper wire bonds on Cu lowK structures during processing
Copy permalink
Date
2004
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Degryse, Dominiek
;
Vandevelde, Bart
;
Beyne, Eric
Journal
Abstract
Description
Metrics
Views
2010
since deposited on 2021-10-15
Acq. date: 2025-12-10
Citations
Metrics
Views
2010
since deposited on 2021-10-15
Acq. date: 2025-12-10
Citations