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FEM study of deformation and stresses in copper wire bonds on Cu lowK structures during processing

Date

2004
Proceedings Paper
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dc.contributor.authorDegryse, Dominiek
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-15T13:11:01Z
dc.date.available2021-10-15T13:11:01Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8823
dc.source.beginpage906
dc.source.conferenceProceedings 54th Electronic Components and Technology Conference
dc.source.conferencedate1/06/2004
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage912
dc.title

FEM study of deformation and stresses in copper wire bonds on Cu lowK structures during processing

dc.typeProceedings paper
dspace.entity.typePublication
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