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Airgap Integration in MP18 Two-Level Semi-damascene Interconnects with Fully Self-aligned Vias

 
dc.contributor.authorDelie, Gilles
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorMarti, Giulio
dc.contributor.authorGupta, Anshul
dc.contributor.authorWu, Chen
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorGavrilov, Anton
dc.contributor.authorCiofi, Ivan
dc.contributor.authorKundu, Souvik
dc.contributor.authorDecoster, Stefan
dc.contributor.authorPark, Seongho
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorDelie, Gilles
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorMarti, Giulio
dc.contributor.imecauthorGupta, Anshul
dc.contributor.imecauthorWu, Chen
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorGavrilov, Anton
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorKundu, Souvik
dc.contributor.imecauthorDecoster, Stefan
dc.contributor.imecauthorPark, Seongho
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecDelie, Gilles::0000-0002-5646-3261
dc.contributor.orcidimecMurdoch, Gayle::0000-0002-6833-220X
dc.contributor.orcidimecGupta, Anshul::0000-0003-4276-5397
dc.contributor.orcidimecWu, Chen::0000-0002-4636-8842
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecGavrilov, Anton::0009-0009-1833-3368
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecKundu, Souvik::0000-0001-5815-8765
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecPark, Seongho::0000-0002-1058-9424
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.date.accessioned2025-06-05T09:53:20Z
dc.date.available2025-03-06T20:46:36Z
dc.date.available2025-06-05T09:53:20Z
dc.date.issued2024
dc.identifier.doi10.1109/IITC61274.2024.10732649
dc.identifier.eisbn979-8-3503-8517-5
dc.identifier.isbn979-8-3503-8518-2
dc.identifier.issn2380-632X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45337
dc.publisherIEEE
dc.source.conference2024 International Interconnect Technology Conference
dc.source.conferencedateJUN 03-06, 2024
dc.source.conferencelocationSan Jose
dc.source.journalN/A
dc.source.numberofpages3
dc.title

Airgap Integration in MP18 Two-Level Semi-damascene Interconnects with Fully Self-aligned Vias

dc.typeProceedings paper
dspace.entity.typePublication
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