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Integration of the 3MS low-k CVD material in a 0.18µm Cu single damascene process
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Integration of the 3MS low-k CVD material in a 0.18µm Cu single damascene process
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Date
1999
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Gao, Teng
;
Gray, William
;
Van Hove, Marleen
;
Struyf, Herbert
;
Meynen, Herman
;
Vanhaelemeersch, Serge
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2020
since deposited on 2021-10-06
Acq. date: 2025-12-10
Citations
Metrics
Views
2020
since deposited on 2021-10-06
Acq. date: 2025-12-10
Citations