Publication:

ESD mitigation for 3D IC hybrid bonding

Date

2023

Proceedings Paper

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Author(s)

Lin, Shih-Hsiang

;

;

Pantano, Nicolas

;

Chen, Shih-Hung

;

Roussel, Philippe

;

Van der Plas, Geert

;

;

Journal

N/A

Metrics

860 since deposited on 2023-11-30

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Acq. date: 2025-12-15