Publication:

ESD mitigation for 3D IC hybrid bonding

Date

2023
Proceedings Paper
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dc.contributor.authorLin, Shih-Hsiang
dc.contributor.authorSimicic, Marko
dc.contributor.authorPantano, Nicolas
dc.contributor.authorChen, Shih-Hung
dc.contributor.authorRoussel, Philippe
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.authorWambacq, Piet
dc.contributor.imecauthorLin, Shih-Hsiang
dc.contributor.imecauthorSimicic, Marko
dc.contributor.imecauthorPantano, Nicolas
dc.contributor.imecauthorChen, Shih-Hung
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorWambacq, Piet
dc.contributor.orcidimecSimicic, Marko::0000-0002-3623-1842
dc.contributor.orcidimecPantano, Nicolas::0000-0002-8803-8374
dc.contributor.orcidimecChen, Shih-Hung::0000-0002-6481-2951
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecWambacq, Piet::0000-0003-4388-7257
dc.date.accessioned2024-03-21T14:01:05Z
dc.date.available2023-11-30T16:47:44Z
dc.date.available2024-03-21T14:01:05Z
dc.date.issued2023
dc.identifier.eisbn978-1-58537-347-5
dc.identifier.issn0739-5159
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43201
dc.publisherIEEE
dc.source.conference45th Annual Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium
dc.source.conferencedateOCT 02-04, 2023
dc.source.conferencelocationRiverside
dc.source.journalN/A
dc.source.numberofpages9
dc.title

ESD mitigation for 3D IC hybrid bonding

dc.typeProceedings paper
dspace.entity.typePublication
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