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Revealing the Origins of Thermally Induced Anomaly in 18 nm Pitch Ruthenium Nanointerconnects on 300 mm Wafers

 
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cris.virtual.orcid0000-0002-1058-9424
cris.virtual.orcid0000-0002-3994-8021
cris.virtual.orcid0000-0002-0290-691X
cris.virtual.orcid0000-0002-5646-3261
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cris.virtualsource.orcidd41bbdfd-20df-46cf-9106-e8e19a469a8d
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dc.contributor.authorShah, Asif A.
dc.contributor.authorDelie, Gilles
dc.contributor.authorKhomyakov, Petr A.
dc.contributor.authorWellendorff, Jess
dc.contributor.authorRichard, Olivier
dc.contributor.authorPark, Seongho
dc.contributor.authorShrivastava, Mayank
dc.contributor.authorCeric, Hajdin
dc.contributor.authorZahedmanesh, Houman
dc.contributor.orcidext0009-0005-4372-5428
dc.contributor.orcidext0000-0003-1005-040X
dc.contributor.orcidext0000-0002-0290-691X
dc.date.accessioned2026-07-27T13:46:13Z
dc.date.available2026-07-27T13:46:13Z
dc.date.createdwos2026
dc.date.issued2026
dc.description.wosFundingTextThe authors would like to acknowledge Geoffrey Pourtois, Christoph Adelmann, Zsolt Tokei, Ivan Ciofi (AR2T), and Dimitri Linten (AR2T) at Imec, Belgium and Julian Schneider from Synopsys Denmark for helpful inputs and discussions during the course of this project. The author A.A.S. would also like to thank Imec, Belgium for a research fellowship and the Govt. of India for a PMRF fellowship.
dc.identifier.doi10.1021/acsami.6c03315
dc.identifier.eissn1944-8252
dc.identifier.issn1944-8244
dc.identifier.issn1944-8252
dc.identifier.pmidMEDLINE:41914472
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59995
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherAMER CHEMICAL SOC
dc.relation.ispartofseriesACS Applied Materials & Interfaces
dc.source.beginpage20763
dc.source.endpage20776
dc.source.issue14
dc.source.journalACS APPLIED MATERIALS & INTERFACES
dc.source.numberofpages14
dc.source.volume18
dc.subject.keywordsFUTURE COPPER INTERCONNECTS
dc.subject.keywordsSELF-DIFFUSION
dc.subject.keywordsOXYGEN
dc.subject.keywordsTECHNOLOGY
dc.subject.keywordsRESISTANCE
dc.subject.keywordsINSIGHTS
dc.subject.keywordsRU(0001)
dc.subject.keywordsMETALS
dc.subject.keywordsCO
dc.subject.keywordsCU
dc.title

Revealing the Origins of Thermally Induced Anomaly in 18 nm Pitch Ruthenium Nanointerconnects on 300 mm Wafers

dc.typeJournal article
dspace.entity.typePublication
imec.internal.crawledAt2026-04-07
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-07-14
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